Version: 15.40.48.5171
OS: Windows 7, 32-bit* Windows 8.1, 32-bit* Windows 10, 32-bit* Windows 8.1, 64-bit* Windows 10, 64-bit* Windows 7, 64-bit*
Type: Drivers
Processor Number
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
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Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.For SKU specific use condition information, see PRQ report.For current use condition information, see pgdngochoi.edu.vn UC (CNDA site)*.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor"s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Cache
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an pgdngochoi.edu.vn integrated memory controller and an pgdngochoi.edu.vn I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an pgdngochoi.edu.vn-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-down Frequency
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an pgdngochoi.edu.vn-defined, high-complexity workload.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for pgdngochoi.edu.vnligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your pgdngochoi.edu.vn representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Processor Graphics ‡
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (VGA)‡
Max Resolution (VGA) is the maximum resolution supported by the processor via the VGA interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
DirectX* Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
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PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TJUNCTION
Junction Temperature is the maximum temperature allowed at the processor die.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which pgdngochoi.edu.vn’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core"s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Secure Key
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Tray Processor
pgdngochoi.edu.vn ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. pgdngochoi.edu.vn refers to these processors as tray or OEM processors. pgdngochoi.edu.vn doesn"t provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
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pgdngochoi.edu.vn classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of pgdngochoi.edu.vn classifications are without recourse to pgdngochoi.edu.vn and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for mpgdngochoi.edu.vnet availability.
pgdngochoi.edu.vn processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.pgdngochoi.edu.vn.com/content/www/us/en/processors/processor-numbers.html for details.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
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